
A variety of Plasma sources
Scanwel offers a variety of different plasma sources through our partnership with both Specs and CCR Technology.
The SPECS sources include the ECR (Electron Cyclotron Resonance) and RF (Radio Frequency) Plasma sources commonly used in HV and UHV processes.
The CCR Technology Plasma sources are commonly found in PECVD, PVD ALD assist, cleaning, etching and activation applications.

The products
- ECR Plasma Sources
- RF Plasma Sources
- Large Plasma Sources
SPECS ECR plasma sources are fully bakeable, with an all-welded stainless steel vacuum envelope, and outstanding cooling from a full-length water-jacket. They are suitable for use in vacuum levels ranging from HV to those found in the most demanding MBE applications. Through the action of the well-known Electron Cyclotron Resonance (ECR) phenomenon, a high-density plasma is created by coupling a radially symmetric GHz microwave field to ions on the surface of a multi-polar magnetic array. With additional sets of the user-exchangeable apertures and extraction grids, the source can be easily reconfigured for oxidizing gases, as a downstream plasma source, or as a dedicated atom or ion source. Both DN40CF and DN63CF flanges are available, so the sources are suitable where space constraints are an issue.
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SPECS RF Plasma Sources are fully UHV compatible for the most demanding MBE applications and surface modifications. A RF current with 13.56 MHz is generated by the RF power supply and fed into a RF coil that surrounds the plasma tube in the source. High RF powers lead to very high-power density in the plasma and thus highest possible cracking efficiencies. The source is fully bakeable with outstanding cooling from a full-length water-jacket. With additional sets of the user-exchangeable extraction grids or aperture plates, the source can be easily reconfigured for reducing gases or as an atom source, downstream plasma source or hybrid source.
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CCR Technology Plasma Sources utilise a filamentless, RF driven, low-pressure plasma source technology. The RF power is inductively coupled to the plasma through a matching network and a single-turn excitation electrode. An essential feature of the design is the tuneable matching network which is incorporated into the source itself. It comprises of resonant circuits which employ variable capacitors to match impedance and hence, maximize the power transfer efficiency to the plasma. The beam produced by the COPRA is quasi-neutral i.e. it contains roughly the same number of ions and electrons permitting deposition, etching and surface modification of both, conducting and insulating substrate materials without significant charge build-up.
Make an enquiry
The products
SPECS ECR plasma sources are fully bakeable, with an all-welded stainless steel vacuum envelope, and outstanding cooling from a full-length water-jacket. They are suitable for use in vacuum levels ranging from HV to those found in the most demanding MBE applications. Through the action of the well-known Electron Cyclotron Resonance (ECR) phenomenon, a high-density plasma is created by coupling a radially symmetric GHz microwave field to ions on the surface of a multi-polar magnetic array. With additional sets of the user-exchangeable apertures and extraction grids, the source can be easily reconfigured for oxidizing gases, as a downstream plasma source, or as a dedicated atom or ion source. Both DN40CF and DN63CF flanges are available, so the sources are suitable where space constraints are an issue.

SPECS RF Plasma Sources are fully UHV compatible for the most demanding MBE applications and surface modifications. A RF current with 13.56 MHz is generated by the RF power supply and fed into a RF coil that surrounds the plasma tube in the source. High RF powers lead to very high-power density in the plasma and thus highest possible cracking efficiencies. The source is fully bakeable with outstanding cooling from a full-length water-jacket. With additional sets of the user-exchangeable extraction grids or aperture plates, the source can be easily reconfigured for reducing gases or as an atom source, downstream plasma source or hybrid source.

CCR Technology Plasma Sources utilise a filamentless, RF driven, low-pressure plasma source technology. The RF power is inductively coupled to the plasma through a matching network and a single-turn excitation electrode. An essential feature of the design is the tuneable matching network which is incorporated into the source itself. It comprises of resonant circuits which employ variable capacitors to match impedance and hence, maximize the power transfer efficiency to the plasma. The beam produced by the COPRA is quasi-neutral i.e. it contains roughly the same number of ions and electrons permitting deposition, etching and surface modification of both, conducting and insulating substrate materials without significant charge build-up.
